DIC and Unitika Collaborate on Development of Special PPS Film with Low Dielectric Properties Suitable for Core Material of Millimeter-Wave Printed Circuit Boards and Millimeter-Wave Radar

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TOKYO — DIC Corporation (TOKYO:4631) announced today that it has developed a new specialty polyphenylene sulfide (PPS) film in collaboration with Japanese firm Unitika Ltd. which suppresses the transmission loss at high frequencies. The low dielectric properties of this product make it suitable for use in key millimeter-wave printed circuit boards compatible with next-generation communications devices and millimeter-wave radar. This new PPS film has been tested by many electronics manufacturers and preparations are currently being made to start commercial production.

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High-frequency compliant printed circuit boards used in smartphones and small electronic devices, among others, are made of bonding layers of liquid crystal polymer (LCP) film and copper foil. LCP creates an adhesive film-copper interface, which is responsible for high transmission losses. Because next-generation communication devices use the millimeter-wave frequency band (30 to 300 GHz), they need materials with low dielectric properties, which reduce transmission loss.

The exclusive PPS film developed by DIC and Unitika combines PPS polymerization’s proprietary technology and Unitika’s integrated film production technology. This new film maintains the low moisture absorption, as well as flame and chemical resistance, of PPS resin, while delivering the outstanding low dielectric properties, dimensional stability, reflow resistance and uniformity of thickness required for high-frequency printed circuit boards. In particular, this product shows stable dielectric properties at high temperatures and in a wide range of frequencies (10 to 1,000 GHz), a performance feature that is difficult to achieve with LCP or other conventional films, therefore it is expected to be used for various applications, from smartphones to cars.

The new film also has excellent adhesion to a variety of materials, meaning it is compatible with a wide range of flexible copper (FCCL) processing methods, including casting and polishing, and adhesive lamination. The method of sputtering and plating, in particular, delivers a smooth adhesive interface that achieves a lower transmission loss than the most commonly used films, including LCP or fluoropolymers.

The DIC Group contributes to digitization by creating functional devices that anticipate emerging needs in the development of next-generation communications infrastructure, including 5G/6G, and generative AI, which are expected to see rapid demand in the coming years.

About DIC Corporation
DIC Corporation is one of the world’s leading chemical companies and is the core of the DIC Group, an international conglomerate that includes about 180 companies, including Sun Chemical Corporation, in more than 60 countries and regions. The DIC Group is recognized as a global market leader for a variety of products essential to modern lifestyles, including packaging materials, display materials such as those used in televisions and computers, and high-performance components for smartphones and other digital devices, as well as automobiles.
Website http://www.dic-global.com/en/

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Company DIC CORP
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